Conductive Type: | X15213-03cl/-03cr, X15223-03cl/-03cr |
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Integration: | X15213-03cl/-03cr, X15223-03cl/-03cr |
Technics: | Semiconductor IC |
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The new LCOS-SLMs feature high power handling capability of 700 W or more, making it suitable for metal processing. The cover glass is made of sapphire glass, which has approximately 30 times higher thermal conductivity than conventional material. In addition, the LCOS-SLM head package contains a filler with high thermal conductivity and an optimized internal structure to increase heat dissipation efficiency. These improvements realized the power handling capability of 700 W or more, the highest level in the world.
By incorporating this product into a laser metal processing system and splitting the laser into multiple beams to perform simultaneous multi-point processing, it is expected to boost production efficiency vastly. In particular, it contributes to a significant reduction in time for metal 3D printing and laser processing that require long processing times, such as molding large and/or complex parts.